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Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

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Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

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Brand Name : Ziitek

Model Number : TIF160-02F Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Product name : Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

Color : Gray white

Outgassing(TML) : 0.30%

Keywords : Silicone Thermal Pad

Thermal conductivity : 1.5W/m-K

Density : 2.3 g/cc

Flame rating : 94 V0

Application : Electronic Component Gap Filling

Hardness : 60 Shore 00

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Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating​

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

The TIF160-02F Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

Typical Properties of TIF160-02F Series
Color
Gray white
Visual
Construction & Compostion
Ceramic filled silicone elastomer
******
Specific Gravity
2.3 g/cc
ASTM D297
Thickness range 0.020"-0.200"
ASTM C351
Hardness
60 Shore 00
ASTM 2240
Dielectric Breakdown Voltage
 >5500 VAC
ASTM D412
Continuos Use Temp
-45 to 200℃
******
Outgassing(TML)
0.35%
ASTM E595
Dielectric Constant
4.0 MHz
ASTM D150
Volume Resistivity
1.0X10¹² Ohm-meter
ASTM D257
Fire rating
94 V0
equivalent UL
Thermal conductivity
1.5W/m-K
ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

2.23 G/CC Notebook Thermal Pad

      

Silicone Notebook Thermal Pad

      

55 Shore 00 Silicon Thermal Pad

      
Quality Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating for sale

Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating Images

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